Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Sunkye R04S Space Grade Micro D Solder Cup Type Connector

  • Micro-D connectors for space applications.
  • Twist pin contacts, high density interconnection, 1.27mm contactspacing and 1.1mm spacing between rows.
  • Contacts:9,15,21,31,37, A51,51,69,100pins.

Brief Introduction of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

  • Product feature:small and light, antivibration etc. high performance.
  • The solder cup can mate with AWG26 and AWG28 wire.
  • Meet space applications.

Material and Finish of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

 ltem Material Finish
shell
Aluminum alloy
Electroless nickel plating
insulator 20%FPPS  -
seal ring Silicone rubber   -
contacts
copper alloy  gold plating
locking hardware
stainless steel passivation
backshell Aluminum alloy
Electroless nickel plating

Electrical Performance of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Performance Marking Rating Value
Current rating(max) I 3A (24#),13A(16#)
Dieletric withstanding voltage(sea level) U 800 Vr.m.x(50Hz)
Contact resistance R ≤10mΩ (24#),≤5mΩ (16#)
Insulation resistance(500VDS,sea level) R ≥5000MΩ

Specification of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Environment: -55℃ ~+125℃ Contact resistance:≤ 21mΩ /
Vibration: 10Hz~ 2000Hz, 294m²/s
 Insulation resistance:≥5000MΩ 100VDC /
Shock: 980m/s² 6ms Dielectric strength: 250V
EIA-364-28, test condition IV
Rated current: 1A Machine life: 200 times /
Random vibration: Power spectral density O.4G²/Hz, root mean square value of total acceleration 23.1G EIA-364-27, test condition E
Salt spray 96h EIA-364-26, test condition B
Humidity 240h ElA-364-31, test condition IV
Thrmal shock
 -55℃ ~+125℃ EIA-364-32, test condition IV
Contact engaging and separating force
0.3~ 1.5 N (24#)
0.56~ 8.35 N(16#)
/
Irradiation resistant Total dose:1X105Gy /
hermal vacuum outgassing
TML≤1%, CVCM≤0.1%
/
Magnetic permeability 200 gamma /

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